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TOGAMID™ BMIs are high performance thermosetting addition-type bismalimides. Their characteristics are similar to polyimides, which include:
- High strength and rigidity at elevated temperatures
- Long-term heat and oxidative stability
- Excellent electrical properties and relatively low propensity for moisture absorption.
Like polyamides, they have outstanding dimensional stability and provide one of the best high temperature performances. Due to their high strength and excellent long-term creep resistance, they can replace metal and other materials in many structural applications.
Like polyamides, they have outstanding dimensional stability and provide one of the best high temperature performances. Due to their high strength and excellent long-term creep resistance, they can replace metal and other materials in many structural applications.
APPLICATIONS
APPLICATIONS
TOGAMID™ BMIs performance lies between lower temperature resistant epoxy systems and very high temperature-resistant polyimides. It can be widely used as a matrix resin for high-performance (fiber-reinforced) composites in the following industries:
Electronics
Aerospace
Automotive
They can also find applications as a high performance adhesive. Below are the BMIs currently offered by APS.
TOGAMID™ BMI-1
TOGAMID™ BMI-1 Industry standard workhorse with:
High Melt Point
Limited Solubility
Can be further modified to improve both properties
TOGAMID™ BMI-2
TOGAMID™ BMI-2 is a Specialty BMI with:
Enhanced Solubility
non-MDA
Low Melt Point
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